Global Thermo Compression Bonder Market is  Projected to reach US$ 19.53  Mn by 2023

This report studies the Thermo Compression Bonder market size (value and volume) by players, regions, product types and end industries, history data 2013-2017 and forecast data 2018-2025; This report also studies the global market competition landscape, market drivers and trends, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter’s Five Forces Analysis.

Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the die in a process called “Thermo Compression Bonding”. The bumps are forced against their opposing pads and a second metallic bond is formed where the bond comes into contact with the package metallization. This technique typically requires the use of heat as high as 350° to 400°C, and forces of as much as 100 g/bump.

Thermo Compression Bonding (TCB) is a chip attach technology under investigation and implementation in multiple platforms. The global Thermo Compression Bonder market is driven by increased Thermo Compression Bonder usage: memory applications currently, logic devices next. Meanwhile, Thermo Compression Bonder is gaining market share from wire bond assembly processes. Also, lower throughput coupled with higher processing costs was example of challenges in the TCB technology.

China Thermo Compression Bonder market is valued at $6.39 million in 2017 and is expected to reach $19.53 million by the end of 2023, growing at a CAGR of 20.47% between 2018 and 2023.

The global Thermo Compression Bonder market was 33 million US$ in 2017 and is expected to 150 million US$ by the end of 2025, growing at a CAGR of 21.0% between 2018 and 2025.

Geographically, this report is segmented into several key regions, with sales, revenue, market share and growth Rate of Thermo Compression Bonder in these regions, from 2013 to 2025, covering

North America (United States, Canada and Mexico),  Europe (Germany, UK, France, Italy, Russia and Turkey etc.),  Asia-Pacific (China, Japan, Korea, India, Australia, Indonesia, Thailand, Philippines, Malaysia and Vietnam),  South America (Brazil etc.),  Middle East and Africa (Egypt and GCC Countries)

The various contributors involved in the value chain of the product include manufacturers, suppliers, distributors, intermediaries, and customers. The key manufacturers in this market include

ASMPT (AMICRA), K&S, Besi, Shibaura, SET, Hanmi

By the product type, the market is primarily split into

Automatic Thermo Compression Bonder, Manual Thermo Compression Bonder

By the end users/application, this report covers the following segments

IDMs, OSAT

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